INDUSTRIAL
Paper and Pulp Industry, Acid Gas Applications, High Temperature Superconductors, ect.
| Element | Percentage (%) |
| Ni (Nickel) | Balance |
| Cr (Chromium) | 14.5 – 16.5 |
| Mo (Molybdenum) | 15.0 – 17.0 |
| Fe (Iron) | 4.0 – 7.0 |
| W (Tungsten) | 3.0 – 4.5 |
| Co (Cobalt) | 2.5 max |
| Mn (Manganese) | 1.0 max |
| Si (Silicon) | 0.08 max |
| C (Carbon) | 0.010 max |
| V (Vanadium) | 0.35 max |
| P (Phosphorus) | 0.04 max |
| S (Sulfur) | 0.03 max |
| Density | 8.9 g/cm³ (0.32 lb/in³) at 20°C |
ASTM B564
HASTELLOY C276 / UNS N10276 / 2.4819
| Heat Treatment | Tensile Strength
min, ksi (MPa) |
Yield Strength
min, (0.2% offset) ksi (MPa) |
Elongation
in 2 in. or 50 mm (or 4 D), min, % |
| Solution annealed | 100 (690) | 41 (283) | 40 |
Bright annealed / annealed
Wooden case
Soft Annealing / Solution Annealing
Solution annealing should take place at temperatures of between 1,100 and 1,160°C (2,012 and 2,120°F).
Fast air cooling can also be carried out at thicknesses of less than approx. 1.5 mm (0.059 in). In the process, the cooling must take place within 2 minutes between 1,000 and 600°C (1,832 and 1,112°F).